Ukuncibilika kweLazer Melting (SLM)
I-Selective Laser Melting noma i-Metal Powder Bed Fusion iyinqubo yokuphrinta ye-3D ekhiqiza izinto eziqinile, kusetshenziswa umthombo oshisayo ukwenza ukuhlangana phakathi kwezinhlayiya zensimbi yensimbi ungqimba owodwa ngasikhathi.
Ubuchwepheshe obuningi bePowder Bed Fusion busebenzisa izindlela zokwengeza impuphu njengoba into isakhiwa, okuholele ekutheni ingxenye yokugcina ivalelwe kufulawa wensimbi. Ukuhluka okuyinhloko kubuchwepheshe bensimbi i-Powder Bed Fusion buvela ekusetshenzisweni kwemithombo yamandla ehlukene; lasers noma electron imishayo.
Izinhlobo ze-3D Ukuphrinta Technology: I-Direct Metal Laser Sintering (i-DMLS); I-Laser Melting (SLM) ekhethiwe; Ukuncibilika kwe-Electron Beam (EBM).
Izinto zokwakha: I-Metal Powder: I-Aluminium, Insimbi Engagqwali, iTitanium.
Ukunemba okukodwa: ± 0.1 mm.
Izicelo Ezijwayelekile: Izingxenye zensimbi ezisebenzayo (i-aerospace nezimoto); Ezokwelapha; Amazinyo.
Amandla: Izingxenye eziqine kakhulu, ezisebenzayo; Amajometri ayinkimbinkimbi.
Ubuthakathaka: Osayizi abancane bokwakha; Iphuzu lentengo eliphakeme kakhulu kubo bonke ubuchwepheshe.
Ukuncibilika kweLazer Melting (SLM)
I-Selective Laser Melting noma i-Metal Powder Bed Fusion iyinqubo yokuphrinta ye-3D ekhiqiza izinto eziqinile, kusetshenziswa umthombo oshisayo ukwenza ukuhlangana phakathi kwezinhlayiya zensimbi yensimbi ungqimba owodwa ngasikhathi.
Ubuchwepheshe obuningi bePowder Bed Fusion busebenzisa izindlela zokwengeza impuphu njengoba into isakhiwa, okuholele ekutheni ingxenye yokugcina ivalelwe kufulawa wensimbi. Ukuhluka okuyinhloko kubuchwepheshe bensimbi i-Powder Bed Fusion buvela ekusetshenzisweni kwemithombo yamandla ehlukene; lasers noma electron imishayo.
Izinhlobo ze-3D Ukuphrinta Technology: I-Direct Metal Laser Sintering (i-DMLS); I-Laser Melting (SLM) ekhethiwe; Ukuncibilika kwe-Electron Beam (EBM).
Izinto zokwakha: I-Metal Powder: I-Aluminium, Insimbi Engagqwali, iTitanium.
Ukunemba okukodwa: ± 0.1 mm.
Izicelo Ezijwayelekile: Izingxenye zensimbi ezisebenzayo (i-aerospace nezimoto); Ezokwelapha; Amazinyo.
Amandla: Izingxenye eziqine kakhulu, ezisebenzayo; Amajometri ayinkimbinkimbi.
Ubuthakathaka: Osayizi abancane bokwakha; Iphuzu lentengo eliphakeme kakhulu kubo bonke ubuchwepheshe.
Ukuncibilika kweLazer Melting (SLM)
I-Selective Laser Melting noma i-Metal Powder Bed Fusion iyinqubo yokuphrinta ye-3D ekhiqiza izinto eziqinile, kusetshenziswa umthombo oshisayo ukwenza ukuhlangana phakathi kwezinhlayiya zensimbi yensimbi ungqimba owodwa ngasikhathi.
Ubuchwepheshe obuningi bePowder Bed Fusion busebenzisa izindlela zokwengeza impuphu njengoba into isakhiwa, okuholele ekutheni ingxenye yokugcina ivalelwe kufulawa wensimbi. Ukuhluka okuyinhloko kubuchwepheshe bensimbi i-Powder Bed Fusion buvela ekusetshenzisweni kwemithombo yamandla ehlukene; lasers noma electron imishayo.
Izinhlobo ze-3D Ukuphrinta Technology: I-Direct Metal Laser Sintering (i-DMLS); I-Laser Melting (SLM) ekhethiwe; Ukuncibilika kwe-Electron Beam (EBM).
Izinto zokwakha: I-Metal Powder: I-Aluminium, Insimbi Engagqwali, iTitanium.
Ukunemba okukodwa: ± 0.1 mm.
Izicelo Ezijwayelekile: Izingxenye zensimbi ezisebenzayo (i-aerospace nezimoto); Ezokwelapha; Amazinyo.
Amandla: Izingxenye eziqine kakhulu, ezisebenzayo; Amajometri ayinkimbinkimbi.
Ubuthakathaka: Osayizi abancane bokwakha; Iphuzu lentengo eliphakeme kakhulu kubo bonke ubuchwepheshe.
''Engineering is the closest thing to
magic that exists in the world"
Uma ubheka imishini ye-Digital Light Processing , lezi zinhlobo zobuchwepheshe bokuphrinta be-3D zicishe zifane ne-SLA. Umehluko omkhulu ukuthi i-DLP isebenzisa iprojektha yokukhanya kwedijithali ukukhanyisa isithombe esisodwa sesendlalelo ngasinye ngasikhathi sinye (noma ukukhanya okuningi kwezingxenye ezinkulu).
Ngoba iphrojektha iyisikrini sedijithali, isithombe sesendlalelo ngasinye sakhiwa ngamaphikseli ayisikwele, okuholela kusendlalelo olwakhiwe ngamabhulokhi amancane angunxande abizwa ngama-voxels.
I-DLP ingafinyelela izikhathi zokuphrinta ezisheshayo ngokuqhathaniswa ne-SLA. Lokho kungenxa yokuthi ungqimba lonke luvezwa konke ngasikhathi sinye, kunokuba ulandele indawo enqamulelayo ngephuzu le-laser.
Ukukhanya kukhonjiswa ku-resin kusetshenziswa izikrini ezikhanyisa ukukhanya kwe-diode (i-LED) noma umthombo wokukhanya we-UV (isibani) esiqondiswe endaweni yokwakha ngeDigital Micromirror Device (DMD).
I-DMD iluhlu lwezibuko ezincane ezilawula lapho kukhonjiswa khona ukukhanya futhi zikhiqize iphethini yokukhanya ebusweni bokwakha.
Izinhlobo ze-3D Ukuphrinta Technology: Ukucubungula Ukukhanya Okuqondile (DLP).
Izinto zokusebenza: I-resin yePhotopolymer (Ejwayelekile, Esabekayo, Ebonakalayo, Ukushisa Okuphezulu).
Ukunemba kobukhulu: ± 0.5% (umkhawulo ophansi ± 0.15 mm).
Izicelo Common: Injection isikhunta-like polymer prototypes; Ubucwebe (ukusakazwa kokutshalwa kwezimali); Izicelo zamazinyo; Izinsiza-kuzwa.
Amandla: Ukuqedwa kobuso obushelelayo; Imininingwane yesici esihle.
Ubuthakathaka: I-Brittle, ayifanele izingxenye zomshini.
Ukucutshungulwa Kokukhanya Kwedijithali (DLP)
